Storage apparatus, card type string apparatus, and electronic apparatus

ABSTRACT

A storage apparatus  10  is disclosed, that comprises a wiring substrate  11  having a first surface and a second surface, a flat type external connection terminal  12   a  disposed on the first surface of the wiring substrate  11 , a semiconductor device  14  disposed on the second surface of the wiring substrate  11  and having a connection terminal  14   a  connected to the flat type external connection terminal  12   a , a molding resin  15  for coating the semiconductor device  14  on the second surface of the wiring substrate  11 , a card type supporting frame  10   a  having a concave portion or a hole portion fitting the wiring substrate  11 , the semiconductor device  14 , and the molding resin  15  in such a manner that the flat type external connection terminal  12   a  is exposed to the first surface of the wiring substrate  11 , and adhesive resin a adhering integrally the flat type external connection terminal  12   a , the wiring substrate  11 , the semiconductor device  14 , the molding resin  15 , and the card type supporting frame  10   a . In addition, the storage apparatus  10  can be combined with a card type supporting means  21  that supports detachably with the flat type external connection terminal  12   a  exposed to one of the surfaces so as to be used as a card type storage apparatus  20  having bigger size.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a storage apparatus, in particular, toa backward compatible storage apparatus suitable for transferring andexchanging digital information between various portable electronicapparatuses. In addition, the present invention relates to a card typestorage apparatus, in particular, to a card type storage apparatussuitable for transferring and exchanging digital information betweenvarious portable electronic apparatuses.

Moreover, the present invention relates to various portable wirelessterminals such as a personal computer, a portable information terminal,a portable telephone unit, and a PHS (Personal Handyphone System) unitand various electronic apparatuses such as a digital camera and a voicerecorder.

2. Description of the Related Art

In recent years, various types of information such as characters, stillpictures, moving pictures, music, and voice are handled as digital data.Various types of storage mediums such as a magnetic tape, a floppy disk,a hard disk, and a magneto-optical disc have been used to record suchtypes of digital data.

For example, a floppy disk is a most-widely used storage medium.However, since the medium should be rotatably-driven, a motor and arotating mechanism are essentially required for a floppy disk drive.Thus, the floppy disk could not be a medium suitable for an electronicapparatus that is small and light.

In addition, portable wireless terminals such as portable telephoneunits and PHS units have become common and their size and weight havebeen reduced. However, such wireless terminals do not have detachablestorage apparatuses. Thus, when a wireless terminal such as a portabletelephone unit or a PHS unit is replaced with a new model, the directoryand various settings of the old unit may not be used for the new unit.Thus, the contents of the directory and settings of the old unit shouldbe manually input to the new unit.

A digital camera with a floppy disk drive that records photographedpictures on a floppy disk has been proposed. With such a digital camera,since photographed pictures are recorded on a floppy disk, the picturescan be used with a PC (Personal Computer) or the like. However, the sizeand weight of the digital camera depend on those of the floppy disk.Thus, since the digital camera becomes large and heavy, it is notsuitable as a portable apparatus.

The storage apparatuses that such portable electronic apparatuses havedo not satisfy both requirements of compatibility with other electronicapparatuses of prior generations and small/light structure necessary forportable apparatuses.

Thus, a storage apparatus that satisfies both requirements ofcompatibility with other electronic apparatuses of prior generations andsmall/light structure is required.

SUMMARY OF THE INVENTION

The present invention is made from the above-described point of view. Anobject of the present invention is to provide a storage apparatus thatis small, thin, and light.

Another object of the present invention is to provide a storageapparatus that has compatibility with other electronic apparatuses ofprior generations and that has small, thin, and light structure.

To solve such problems, the storage apparatus, the card type storageapparatus, and the electronic apparatus according to the presentinvention have the following structures.

The present invention is a storage apparatus, comprising a wiringsubstrate having a first surface and a second surface, a flat typeexternal connection terminal disposed on the first surface of the wiringsubstrate, a semiconductor device disposed on the second surface of thewiring substrate and having a connection terminal connected to the flattype external connection terminal, and a card type molding resin forcoating the semiconductor device on the second surface of the wiringsubstrate with the same height as an exposed surface of the flat typeexternal connection terminal.

The present invention is a storage apparatus, comprising a wiringsubstrate having a first surface and a second surface, a flat typeexternal connection terminal disposed on the first surface of the wiringsubstrate, a semiconductor device disposed on the second surface of thewiring substrate and having a connection terminal connected to the flattype external connection terminal, molding resin for coating thesemiconductor device on the second surface of the wiring substrate, acard type supporting frame having a concave portion or a hole portionformed on at least one surface of the card type supporting frame, theconcave portion or the hole portion fitting the wiring substrate, thesemiconductor device, and the molding resin in such a manner that theflat type external connection terminal is exposed to the first surfaceof the wiring substrate, and adhesive resin filled in a supporting spaceformed among the flat type external connection terminal, the wiringsubstrate, the molding resin, and the card type supporting frame so asto integrally adhere the flat type external connection terminal, thewiring substrate, the semiconductor device, the molding resin, and thecard type supporting frame.

A molding resin free portion is formed at an edge portion of the flattype external connection terminal. A concave portion or a hole portionof the card type supporting frame can be a shouldered concave portion ora shouldered hole portion having a first portion and a second portion,the first portion being fitted to the molding resin free portion of theflat type external connection terminal, the second portion being fittedto the molding resin portion of the flat type external connectionterminal.

The area of the card type molding resin portion of the storage apparatusor the area of the card type supporting frame is the half or less of thearea of the flat type external connection terminal.

The molding resin is preferably disposed on the second surface of thewiring substrate in such a manner that the molding resin isunsymmetrically disposed in one symmetrical direction on the secondsurface of the wiring substrate. In the following description, “moldingresin unsymmetrically disposed in one symmetrical direction” representsfor example a rectangular substrate that is symmetrical with respect toa first line in parallel with the longer side of the substrate andpassing through the center of the substrate and that is not symmetricalwith respect to a second line perpendicular to the first line. Themolding resin may have a mark, for example arrow, that represents adirection parallel to the symmetrical direction. Thus, since the storageapparatus is unsymmetrically shaped, the storage apparatus can besecurely and easily attached to the host side unit. The mark ispreferably a linear pattern. When a concave pattern is formed on thesurface, the area becomes thin. Thus, the strength of the storageapparatus deteriorates. On the other hand, when a convex pattern isformed, since the thickness of the storage apparatus becomes large, therequirement for small and thin structure cannot be satisfied.

In addition, with the molding resin having one or plural notches thestorage apparatus is unsymmetrically shaped and voltage display functionor discrimination function and the like is provided. When the moldingresin have notch, one symmetrical direction is not realized.

The semiconductor device may be a serial access type semiconductor. Thesemiconductor device may be a flash memory. The semiconductor device maybe a NAND type EEPROM or an AND type EEPROM.

The serial access type semiconductor device sequentially inputs andoutputs read data, write data, and commands through common I/O pins. Theserial access type semiconductor device does not have an addressterminal.

Thus, regardless of the integration degree of the semiconductor device,the structure of the flat type external connection terminal (forexample, the number of pins) can be standardized.

The flat type external connection terminal may be composed of aconductor layer disposed on the first surface of the wiring substrateand having a slit for separating the first surface into a plurality ofareas. Thus, the most portion of the surface of the wiring substrate canbe coated with copper, gold, or the like. Consequently, the strength ofthe storage apparatus improves.

A pattern of the slit may connect any two points of the outer peripheryof the conductor layer as a curved line or a bent line. Thus, thestrength of the storage apparatus against bending force and twistingforce improves.

The wiring substrate may have a barrier layer composed of metal, forexample gold, the barrier layer being exposed to the molding resin freearea on the second surface. Thus, when mold resin is formedcorresponding to transfer mold method, the productivity improves. Inother words, a gate from which non-harden resin is filled is formed onthe barrier layer. Although resin such as prepreg of the wiringsubstrate securely adheres to the mold resin, such resin can be easilypeeled off on the barrier/layer.

The barrier layer may be electrically insulated from a connectionterminal of the storage apparatus.

The present invention is a card type storage apparatus, comprising astorage apparatus having a wiring substrate having a first surface and asecond surface, a flat type external connection terminal disposed on thefirst surface of the wiring substrate, a semiconductor device disposedon the second surface of the wiring substrate and having a connectionterminal connected to the flat type external connection terminal, andmolding resin for coating the semiconductor device on the second surfaceof the wiring substrate, and a card type supporting means having a firstsurface and for detachably supporting the storage apparatus in such amanner that the flat type external connection terminal is exposed to thefirst surface of the card type supporting means.

The present invention is a card type storage apparatus, comprising astorage apparatus having a wiring substrate having a first surface and asecond surface, a flat type external connection terminal disposed on thefirst surface of the wiring substrate, a semiconductor device disposedon the second surface of the wiring substrate and having a connectionterminal connected to the flat type external connection terminal,molding resin for coating the semiconductor device on the second surfaceof the wiring substrate, a card type supporting frame having a concaveportion or a hole portion formed on at least one surface of the cardtype supporting frame, the concave portion or the hole portion fittingthe wiring substrate, the semiconductor device, and the molding resin insuch a manner that the flat type external connection terminal is exposedto the first surface of the wiring substrate, and adhesive resin filledbetween at least one of the flat type external connection terminal, thewiring substrate, the semiconductor device and the molding resin, andthe card type supporting frame so as to adhere integrally the flat typeexternal connection terminal.

In the card type storage apparatus, the storage apparatus according tothe present invention is detachably attached to the supporting means.Thus, the storage apparatus can be easily handled.

The supporting means has a concave portion and a slit formed on thefirst surface thereof. The card type supporting frame is inserted intothe concave portion. The slit is formed on both edge surfaces of theconcave portion along the insertion direction of the card type moldingresin or the card type supporting frame. Thus, the card type moldingresin or the card type supporting frame can be fitted to the supportingmeans.

The supporting means has a tapered overhang portion for nipping the cardtype molding resin portion or the card type supporting frame, thetapered overhang portion being disposed on both edge surfaces of theconcave portion along the insertion direction.

The supporting means has a concave portion with a shoulder correspondingto a molding resin area on the second surface of the wiring substrateand an exposed area on the first surface of the supporting means. Inother words, in the storage apparatus according to the presentinvention, the molding resin is not disposed symmetrically with thesecond surface of the wiring substrate. Thus, the card that supports thestorage apparatus should have a concave portion corresponding to themolding resin.

Consequently, the storage apparatus can be correctly attached to thesupporting means. Thus, the storage apparatus can be prevented frommalfunctioning and being damaged.

The depth of the concave portion may be larger than the thickness of thestorage apparatus.

Thus, the semiconductor device can be protected against the stressapplied in the direction of the thickness of the card type storageapparatus. The supporting means may be flexible.

The bottom portion of the supporting menas that forms the concaveportion may be composed of a metal plate such as a SUS plate so as toreinforce it.

The card type storage apparatus may further comprise a securing meansfor securing the storage apparatus supported by the supporting means.

Although the securing means secures the storage apparatus to the cardtype supporting means (the support card), the securing is preferablydetachably structured. The securing means may be a double-adhesive tapeor adhesive resin layer and the like disposed at the shoulder portion ofthe supporting means.

The adhesive strength between the double-adhesive tape and thesupporting means is larger than the adhesive strength between thedouble-adhesive tape and the storage apparatus. Thus, the storageapparatus can be repeatedly attached and detached to/from the supportingmeans.

In addition, either the storage apparatus or the supporting means has aconvex portion and the other one has a concave portion fitting to theconvex portion. Thus, when the storage apparatus is inserted into thesupporting means, the storage apparatus and the supporting means fit atthe uneven part and detach each other with a designated power in thedirection to separate.

The present invention is a card type storage apparatus, comprising astorage apparatus having a wiring substrate having a first surface and asecond surface, a flat type external connection terminal disposed on thefirst surface of the wiring substrate, a semiconductor device disposedon the second surface of the wiring substrate and having a connectionterminal connected to the flat type external connection terminal, andmolding resin for coating the semiconductor device on the second surfaceof the wiring substrate, and a card type supporting means having a firstsurface and for supporting the storage apparatus in such a manner thatthe flat type external connection terminal is exposed to the firstsurface of the card type supporting means, wherein the supporting meansis composed of a first portion and a second portion, the first portionsurrounding the storage apparatus, the second portion being detachablyconnected to the first portion.

The second portion may have a slit for fitting the first portion.

The second portion may have an opening portion for fitting the firstportion.

An edge surface of the first portion may be tapered. An edge of theopening portion of the second portion may have an overhang portion fornipping the edge surface of the first portion.

The first portion and the second portion may have a concave portion anda convex portion so as to secure the first portion and the secondportion.

The second portion may be composed of a material with flexibility.

The card type storage apparatus according to the present inventioncomplies with JEDEC MO-180 standard. In particular, the thickness of thecard type storage apparatus should strictly comply with the standard. Inother words, the thickness of the card type storage apparatus is 0.76mm±0.08 mm or 1.4 mm±0.1 mm. The outer size of the card type storageapparatus is 37.0 mm (wide)×45.0 mm (long).

The present invention is an electronic apparatus, comprising (a) astorage apparatus having a wiring substrate having a first surface and asecond surface, a flat type external connection terminal disposed on thefirst surface of the wiring substrate, a semiconductor device disposedon the second surface of the wiring substrate and having a connectionterminal connected to the flat type external connection terminal, and acard type molding resin layer for coating the semiconductor device onthe second surface of the wiring substrate with the same height as theexposed surface of the flat type external connection terminal, (b) asupporting means for supporting the storage apparatus, (c) a connectionelectrode that is contacted to the flat type connection terminal whenthe storage apparatus is supported by the supporting means, and (d) adriving circuit for accessing the semiconductor device through theconnection electrode and the flat type external connection terminal.

The present invention is an electronic apparatus, comprising (a) awiring substrate having a first surface and a second surface, a flattype external connection terminal disposed on the first surface of thewiring substrate, a semiconductor device disposed on the second surfaceof the wiring substrate and having a connection terminal connected tothe flat type external connection terminal, molding resin for coatingthe semiconductor device on the second surface of the wiring substrate,a card type supporting frame having a concave portion or a hole portionformed on at least one surface of the card type supporting frame, theconcave portion or the hole portion fitting the wiring substrate, thesemiconductor device, and the molding resin in such a manner that theflat type external connection terminal is exposed to the first surfaceof the wiring substrate, and adhesive resin filled in a supporting spaceformed among the flat type external connection terminal, the wiringsubstrate, the semiconductor device, the molding resin, and the cardtype supporting frame so as to integrally adhere the flat type externalconnection terminal, the wiring substrate, the semiconductor device, themolding resin, and the card type supporting frame, (b) a supportingmeans for supporting the storage apparatus, (c) a connection electrodethat is contacted to the flat type connection terminal when the storageapparatus is supported by the supporting means, and (d) a drivingcircuit for accessing the semiconductor device through the connectionelectrode and the flat type external connection terminal.

It is preferred that the driving circuit serially accesses thesemiconductor device.

According to the present invention, since the molding resin isunsymmetrically disposed on the wiring substrate, the storage apparatuscan be properly attached to the host side unit. Thus, characteristics ofsmall, thin, and light structure are satisfied, the user can easily knowthe attaching direction of the storage apparatus to the host side unit.Consequently, the semiconductor apparatus can be prevented frommalfunctioning and being damaged.

According to the present invention, since the molding resin isunsymmetrically disposed on the wiring substrate, the storage apparatuscan be properly attached to the host side unit. Thus, theuser-friendliness improves. In addition, the semiconductor apparatus canbe prevented from malfunctioning and being damaged.

In the storage apparatus according to the present invention, since theserial access type memory device and the flat type external connectionterminal are used in combination, the outer size of the storageapparatus becomes close to the outer size of the memory device. Thus,the storage apparatus according to the present invention is suitable foran external storage apparatus used in a small mobile communicationterminal such as a portable telephone unit, a PHS unit, a pocket bell,or a PDA.

In addition, when the serial access type memory device and the flat typeexternal connection terminal are used in combination, the structure ofthe flat type external connection electrodes of the storage apparatusand the structure of the host side electronic apparatus can bestandardized.

In the card type storage apparatus according to the present invention,since the molding resin of the storage apparatus is unsymmetricallyfitted to the support card, the storage apparatus can be properlyattached to the support card. Thus, the user-friendliness improves.Consequently, the storage apparatus can be prevented from malfunctioningand being damaged.

In the card type storage apparatus according to the present invention,since the support card is separated into a plurality of portion's, thestorage apparatus can be connected to a host side unit that is smallerthan the outer size of the support card.

In the electronic apparatus according to the present invention, thestorage apparatus can be properly attached to the electronic apparatus.Thus, when the storage apparatus is connected to a host side electronicapparatus such as a portable telephone unit, a PHS unit, a pocket bell,a PDA, a PC, or a digital camera, the electronic apparatus can beprevented from malfunctioning or being damaged. In addition, theuser-friendliness remarkably improves. So far, it was difficult toaccomplish an external connecting unit that can be used in common with aportable telephone unit, a PHS unit, a pocket bell, a PDA unit, adigital camera, a note type PC, a PC, and so forth. However, with thestorage apparatus and the electronic apparatus according to the presentinvention, data such as telephone numbers registered to a portabletelephone unit, text data, picture data, and so forth received throughInternet can be transferred to and shared with other informationprocessing units.

These and other objects, features and advantages of the presentinvention will become more apparent in light of the following detaileddescription of a best mode embodiment thereof, as illustrated in theaccompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective front view showing an example of the structureof a storage apparatus according to a first embodiment of the presentinvention;

FIG. 2 is a perspective rear view showing the structure of the storageapparatus shown in FIG. 1;

FIG. 3A is a side view on a shorter side of the storage apparatus shownin FIG. 1;

FIG. 3B is side view parallel to the storage apparatus on a longer sideshown in FIG. 1;

FIG. 4 is a sectional view showing an example of the structure of thestorage apparatus according to the first embodiment of the presentinvention;

FIG. 5A is perspective view showing an example of the structure of acard type storage apparatus according to a second embodiment of thepresent invention;

FIG. 5B is perspective view showing an example of the structure of asupport cad of a storage apparatus according to a second embodiment ofthe present invention;

FIG. 6 is a sectional view showing an example of the structure of anelectronic apparatus according to a third embodiment of the presentinvention;

FIG. 7 is a sectional view showing an example of the structure of anelectronic apparatus according to the third embodiment of the presentinvention;

FIG. 8 is a perspective view showing an example of the structure ofconnection electrodes of the electronic apparatus according to the thirdembodiment of the present invention;

FIG. 9 is a plan view showing another example of the structure of a cardtype storage apparatus according to a fourth embodiment of the presentinvention;

FIG. 10 is a plan view showing another example of the structure of thecard type storage apparatus according to the fourth embodiment of thepresent invention;

FIG. 11 is a plan view showing another example of the structure of thecard type storage apparatus according to the fourth embodiment of thepresent invention;

FIG. 12 is a plan view showing another example of the structure of thecard type storage apparatus according to the fourth embodiment of thepresent invention;

FIG. 13 is a plan view showing another example of the structure of thecard type storage apparatus according to the fourth embodiment of thepresent invention;

FIG. 14 is a plan view showing another example of the structure of thecard type storage apparatus according to the fourth embodiment of thepresent invention;

FIG. 15 is a plan view showing the state that the first area is detachedfrom the second area in the example of FIG. 10;

FIG. 16 is a plan view showing the state that the first area is detachedfrom the second area in the example of FIG. 12;

FIG. 17 is a plan view showing the state that the first area is detachedfrom the second area in the example of FIG. 13.

FIG. 18 is a plan view showing the state that the first area is detachedfrom the second area in the example of FIG. 14;

FIG. 19A is a sectional views parallel to a shorter side of the storageapparatus of FIG. 12;

FIG. 19B is a sectional view parallel to a longer side of the storageapparatus of FIG. 12;

FIG. 19C is a sectional view, parallel to a longer side of the storageapparatus of FIG. 10;

FIG. 19D is a sectional view, showing another example of the structure,parallel to a longer side of the storage apparatus according to thefourth embodiment of the present invention;

FIG. 20 is a perspective view showing an example of the structure of acard type storage apparatus according to a fifth embodiment of thepresent invention;

FIG. 21 is a perspective view showing an example of the structure of acard type storage apparatus according to a sixth embodiment of thepresent invention;

FIG. 22A is a plan view showing an example of the structure of a cardtype storage apparatus according to a seventh embodiment of the presentinvention;

FIG. 22B is a sectional view taken along line A-A shown in FIG. 22A;

FIG. 22C is a perspective view showing the state that a first area 21 ais attached to a second area 21 b shown in FIG. 22A;

FIG. 22D is a sectional view taken along line B-B shown in FIG. 22A;

FIG. 23A is a plan view showing an example of the structure of a supportcard of a card type storage apparatus according to an eighth embodimentof the present invention;

FIG. 23B is a sectional view taken along line A-A shown in FIG. 23A;

FIG. 23C is a sectional view of a support card in another embodimentcorresponding to FIG. 23B;

FIG. 24A is a plan view showing another example of the structure of acard type storage apparatus according to the eighth embodiment of thepresent invention;

FIG. 24B is a sectional view taken along line B-B shown in FIG. 24A;

FIG. 24C is a sectional view taken along line C-C shown in FIG. 24A;

FIG. 25A is a perspective view showing another example of the structureof a storage apparatus of a card type storage apparatus according to theeighth embodiment of the present invention; and

FIG. 25B is a sectional view taken along line A-A shown in FIG. 25A; and

FIG. 25C is a perspective view showing the storage apparatus of FIG. 25Aand a support card.

FIG. 26 is a block diagram showing the structure of which a card typestorage apparatus according to the present invention is applied to apicture/audio storing medium for a digital audio system.

DESCRIPTION OF PREFERRED EMBODIMENTS

Next, embodiments of the present invention will be described in detail.

First Embodiment

FIGS. 1 and 2 are a perspective front view and a perspective rear viewshowing an example of the structure of a storage apparatus according toa first embodiment of the present invention, respectively.

FIG. 3A is a sectional view on a shorter side of the storage apparatusshown in FIGS. 1 and 2. FIG. 3B is a sectional view on a longer side ofthe storage apparatus shown in FIGS. 1 and 2.

FIG. 4 is a detailed sectional view showing an example of the structureof the storage apparatus parallel to the first embodiment of the presentinvention on a shorter side.

In FIG. 4, reference numeral 10 is a storage apparatus. The storageapparatus 10 comprises a wiring substrate 11, a flat type externalconnection terminal 12 a, a semiconductor device 14, and molding resin15. The wiring substrate 11 has a first surface and a second surface.The flat type external connection terminal 12 a is disposed on the firstsurface of the wiring substrate 11. The semiconductor device 14 isdisposed on the second surface of the wiring substrate 11. Thesemiconductor device 14 has a connection terminal 14 a connected to theflat type external connection terminal 12 a. The molding resin 15unsymmetrically coats the semiconductor device 14 on the second surfaceof the wiring substrate 11.

In the example, the semiconductor device 14 is disposed at a concaveportion on the upper surface (second surface) of the wiring substrate 11through a bonding agent layer (not shown). The connection terminal 14 aof the semiconductor device 14 and the connection terminal 12 b of thewiring substrate 11 are connected with a bonding wire 16. The connectionterminal 12 b of the wiring substrate and the flat type externalconnection terminal 12 a are connected through a via-hole 12 h. Sincethe semiconductor device 14 is disposed at the concave portion formed onthe upper surface of the wiring substrate 11, the height of the storageapparatus is reduced.

In the example, the semiconductor device 14 is a NAND type EEPROM thatis a serial access memory device. Alternatively, as the semiconductordevice 14, an AND type EEPROM or another memory device can be used.

The semiconductor device 14 may be connected to the wiring substrate 11with a flip-chip using conductive bumps (corresponding to face-downbonding method) rather than the bonding wires 16. In addition, thelayers of the wiring substrate 11 may be connected with conductivepillars rather than the via-holes 14 h.

In the storage apparatus 10 according to the present invention, themolding resin 15 is unsymmetrically disposed on the second surface ofthe wiring substrate 11. In the example, the molding resin 15 deviatesto the longer side of the wiring substrate 11.

In such a structure, the storage apparatus according to the presentinvention can be correctly attached to (inserted into) a host sideelectronic apparatus 30. Thus, the storage apparatus can be preventedfrom malfunctioning and being damaged. The host side electronicapparatus is for example a portable telephone unit, a PHS unit, a pocketbell (beeper), a PDA, a PC (Personal Computer), and a digital camera.

In the example, as shown in FIG. 2, a mark 17 that represents theinserting direction of the storage apparatus is placed on the frontsurface of the molding resin 15. The mark 17 is preferably formed with alinear pattern rather than a concave patter or a convex pattern.

On the second surface of the wiring substrate 11 (namely, on the surfaceof which the semiconductor device 14 is disposed), a metal barrier 18 isdisposed along with a wiring pattern on the wiring substrate 11. Withthe metal barrier 18, when the molding resin 15 is formed with transfermold or the like, the strength of the wiring substrate 11 improves. Inaddition, the resin can be easily peeled off a mold.

Since text data, picture data, music data, medical data, financial data,various types of authentication data, and so forth can be handled withthe storage apparatus according to the present invention, data can beexchanged among a plurality of host side electronic apparatuses. Inaddition, the storage apparatus according to the present invention canhighly maintain compatibility with various electronic apparatuses.

Second Embodiment

FIG. 5A is a perspective view showing an example of the structure of acard type storage apparatus according to a second embodiment of thepresent invention, and FIG. 5B is a perspective view showing a supportcard of the card type storage apparatus.

In the card type storage apparatus, the storage apparatus according tothe first embodiment of the present invention is held by a support card.

In FIGS. 5A and 5B, reference numeral 20 is a card type storageapparatus 20 according to the second embodiment of the presentinvention. The card type storage apparatus 20 comprises a storageapparatus 10 according to the first embodiment of the present inventionand a support card 21. The support card 21 detachably supports thestorage apparatus 10 in such a manner that the flat type externalconnection terminal 12 a is exposed.

The support card 21 has a concave portion 22 that supports the storageapparatus 10. The concave portion 22 is formed so that it fits the shapeof the molding resin 15 of the storage apparatus 10. In other words,since the molding resin 15 in the storage apparatus 10 according to thepresent invention is unsymmetrically disposed against the wiringsubstrate 11, the concave portion 22 of the support card 21 is formedcorresponding to the shape of the molding resin 15 of the storageapparatus 10. Thus, the concave portion 22 has a shoulder portioncorresponding to a frame area in which the molding resin 15 is notdisposed on the semiconductor device side of the wiring substrate 11.With the shoulder portion, the storage apparatus is supported. Dependingon the unsymmetrically disposed molding resin 15, the width of theshoulder portion may vary so that d1>d2 (where d1 is the width of theshoulder portion on one side of the concave portion 22; and d2 is thewidth of the shoulder portion on the other side of the concave portion22). With such a structure, the storage apparatus 10 can be properlyattached to the support card 21. Thus, when the card type storageapparatus is connected to a host side electronic apparatus such as adigital camera or a personal computer (including PC through a PCMCIAcard), the card type storage apparatus can be prevented frommalfunctioning and being damaged. In addition, the user-friendlinessremarkably improves.

The depth of the concave portion 22 of the support card 21 is slightlylarger than the thickness of the storage apparatus 10. Thus, when thestorage apparatus 10 is supported by the support card 21 or whenelectrodes of a host side electronic apparatus are accessed to the flattype external connection terminal 12 a, the stress applied in thedirection of the thickness of the storage apparatus can be alleviated.Consequently, the reliability of the storage apparatus 10 improves.

An adhesive tape may be placed on the shoulder portion of the concaveportion 22 so as to secure the storage apparatus 10. By adjusting theadhesive strength of the adhesive tape to the wiring substrate 11 andthe support card 21, when necessary, the storage apparatus 11 can bedetached from the support card 21.

The support card 21 has a cut-out portion 23 and a write protect area24. With the cut-out portion 23, the operation voltage of thesemiconductor device 14 of the storage apparatus 10 is determined. Withthe write protect area 24, the data write enable state is determined.When a seal is adhered to the write protect area 24, data can beprohibited from being written to the storage apparatus 10.

When the outer size of the support card (base card) of the card typestorage apparatus according to the present invention is the same as thatof for example a smart medium, data can be exchanged with a smallelectronic apparatus while maintaining electrical and mechanicalinterfaces with the smart medium.

Third Embodiment

FIGS. 6 and 7 are sectional views showing an example of the structure ofan electronic apparatus according to a third embodiment of the presentinvention.

FIG. 6 shows the state of which the storage apparatus 10 is detachedfrom the electronic apparatus 30 according to the present invention.FIG. 7 shows the state of which the storage apparatus 10 according tothe present invention is attached to the electronic apparatus 30according to the present invention.

The electronic apparatus 30 comprises a concave portion 31, a connectionelectrode 32, and a driving circuit (not shown). The concave portion 31supports the storage apparatus according to the present invention. Whenthe storage apparatus 10 is supported with the concave portion 31, theconnection electrode 32 is connected to the flat type connectionterminal 12 a of the storage apparatus 10. The driving circuit drivesthe semiconductor device 14 through the connection electrode 32 and theflat type external connection terminal 12 a. The driving circuit is forexample a driver IC. The electronic apparatus is for example a portabletelephone unit, a PHS unit, a pocket bell, a PDA, a digital camera, anote type PC, a PC, a voice recorder, or an electronic book.

The structure of the concave portion 30 of the electronic apparatus 30is the same as the concave portion 22 of the support card 21. Thus, theconcave portion 31 has a shoulder portion corresponding to a frame areain which the molding resin 15 is not disposed on the semiconductordevice side of the wiring substrate 11 of the storage apparatus 10. Withthe shoulder portion, the storage apparatus is supported. Depending onthe unsymmetrically disposed molding resin 15, the width of the shoulderportion may vary so that d1>d2 (where d1 is the width of the shoulderportion on one side of the concave portion 31; and d2 is the width ofthe shoulder portion on the other side of the concave portion 31).

With such a structure, the storage apparatus 10 can be properly attachedto the electronic apparatus 30. Thus, when the card type storageapparatus is connected to the host side electronic apparatus 30 such asa portable telephone unit, a PHS unit, a pocket bell, a PDA, a PC, or adigital camera, the storage apparatus 10 can be prevented frommalfunctioning and being damaged. In addition, the user-friendlinessremarkably improves.

FIG. 8 is a perspective view showing an example of the structure of theconnection electrode 32 of the electronic apparatus 30 according to thethird embodiment of the present invention.

The connection electrode 32 has a plurality of pins 32 a correspondingto the flat type external connection terminal 12 a of the storageapparatus 10. The host side driving circuit is accessed to thesemiconductor device 14 through the pins 32 a and the flat type externalconnection terminal 12 a.

In the storage apparatus 10 according to the present invention, themolding resin 15 is unsymmetrically disposed. In addition, the concaveportion of the host side electronic apparatus 30 has the shoulderportion which realizes unsymmetry. Thus, the connection electrode 32 ofthe electronic apparatus 30 can be correctly connected to the flat typeexternal connection terminal 12 a of the storage apparatus 10.Consequently, the reliability of the system improves. In addition, theuser-friendliness improves.

So far, it was difficult to accomplish an external connecting unit thatcan be used in common with a portable telephone unit, a PHS unit, apocket bell, a PDA, a digital camera, a note type PC, a PC, and soforth. However, with the storage apparatus according to the presentinvention or the electronic apparatus according to the presentinvention, data such as telephone numbers stored in a portable telephoneunit and text data, picture data, and so forth received through Internetcan be transferred to another information processing unit or sharedtherewith. Likewise, such data can be transmitted. For example, with adigital camera or a portable telephone unit that can be accessed to thestorage apparatus according to the present invention, a picturephotographed by the digital camera can be easily transmitted through theportable telephone unit.

Fourth Embodiment

FIGS. 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19A, 19B, 19C and 19D areplan views and sectional views showing examples of the structure of acard type storage apparatus according to a fourth embodiment of thepresent invention.

The structure of the card type storage apparatus shown in FIG. 9 is thesame as the structure of the card type storage apparatus 20 shown inFIGS. 5A and 5B. The card type storage apparatus shown in FIG. 9comprises a storage apparatus 10 and a support card 21. The support card21 supports the storage apparatus 10.

The storage apparatus 10 has a structure shown in FIGS. 19A and 19B.FIG. 19A is a sectional drawing parallel to a shorter side of thestorage apparatus. FIG. 19B is a sectional drawing parallel to a longerside of the storage apparatus.

In other words, the storage apparatus 10 shown in FIG. 3 is fitted to aframe member 10 a composed of synthetic resin. The storage apparatus 10and the frame member 10 a are adhered with adhesive resin a.

The frame member 10 a has a shoulder portion b and a hole portion c.With the shoulder portion b, a substrate 11 is fitted to the framemember 10 a. With the hole portion c, a molding resin portion 15 isfitted to the frame member 10 a. Since the storage apparatus 10 isfitted to the shouldered hole portion, the storage apparatus 10 isformed in a card shape.

In the storage apparatus 10, as shown in FIG. 19C, the molding resinportion 15 may be disposed on the center of the substrate 11, instead ofbeing disposed unsymmetrically against the substrate 11.

In addition, as shown in FIG. 19D, the frame member 10 a can besubstitute for the molding resin portion 15.

In the example shown in FIG. 9, the length L on the longer side of thesupport card 21 is around 45.0 mm. The length S on the shorter side ofthe support card 21 is around 37.0 mm. When the storage apparatus 10 isdetached from the support card 21 and only the storage apparatus 10 isattached to the host side electronic apparatus 30, the electronicapparatus 30 can be compactly formed.

In the examples shown in FIGS. 10 to 18, the support card 21 isdetachable from the frame member 10 a including the storage apparatus orfrom the molding resin portion 15.

In the card type storage apparatus shown in FIG. 10, a support card 21has a first area 21 a and a second area 21 b. The first area 21 a isformed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 10, the first area 21 a isdetachable from the second area 21 b.

The frame shape first area 21 a is the area in which the frame member 10a substitute for the molding resin portion 15 shown in FIG. 19D, or thestorage apparatus 10 is fitted to a frame member 10 a composed ofsynthetic resin and the storage apparatus 10 and the frame-member 10 aare adhered with adhesive resin a shown in FIG. 19A, 19B and 19C. In theexample, the support card 21 is formed in a rectangular shape of whichthe length Ls on the longer side of the first area 21 a of the supportcard is 30.0 mm and the length Ss on the shorter side of the first area21 a of the support card is 19.0 mm.

In the card type storage apparatus shown in FIG. 11, a support card 21has a first area 21 a and a second area 21 b. The first area 21 a isformed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 11, the first area 21 a isdetachable from the second area 21 b.

In the example, the support card 21 is formed in a rectangular shape ofwhich the length Ls on the longer side of the first area 21 a of thesupport card is 30.0 mm and the length Ss on the shorter side of thefirst area 21 a of the support card is 23.0 mm.

In the card type storage apparatus shown in FIG. 12, a support card 21has a first area 21 a and a second area 21 b. The first area 21 a isformed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 12, the first area 21 a isdetachable from the second area 21 b.

In the example, the support card 21 is formed in a rectangular shape ofwhich the length. Ls on the longer side of the first area 21 a of thesupport card is 35.5 mm and the length Ss on the shorter side of thefirst area 21 a of the support card is 19.0 mm.

In the card type storage apparatus shown in FIG. 13, a support card 21has a first area 21 a and a second area 21 b. The first area 21 a isformed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 13, the first area 21 a isdetachable from the second area 21 b.

In the example, the support card 21 is formed in a rectangular shape ofwhich the length Ls on the longer side of the first area 21 a of thesupport card is 30.0 mm and the length Ss on the shorter side of thefirst area 21 a of the support card is 23.0 mm.

In the card type storage apparatus shown in FIG. 14, a support card 21has a first area 21 a and a second area 21 b. The first area 21 a isformed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 14, the first area 21 a isdetachable from the second area 21 b.

In the example, the support card 21 is formed in a rectangular shape ofwhich the length Ls on the longer side of the first area 21 a of thesupport card is 37.0 mm and the length Ss on the shorter side of thefirst area 21 a of the support card is 25.0 mm.

FIGS. 15, 16, 17, and 18 are plan views showing the state that the firstarea 21 a of the card type storage apparatus is detached from the secondarea 21 b in the examples shown in FIGS. 10, 12, 13, and 14,respectively.

Thus, in the card type storage apparatus according to the presentinvention, the first area 21 a is detachable from the second area 21 b.Consequently, the card type storage apparatus can be attached to a hostside electronic apparatus that is smaller than the outer size of thesupport card 21.

The thickness of the card type storage apparatus according to the fourthembodiment is 0.76±0.08 mm. In the card type storage apparatus accordingto the present invention, the size and thickness thereof can be adjustedwhen necessary.

Fifth Embodiment

FIG. 20 is a perspective view showing an example of the structure of adetachable card type storage apparatus according to a fifth embodimentof the present invention.

A first area 21 a and a second area 21 b of a support card have shoulderportions formed on edge surfaces in parallel with the insertingdirection of the second area 21 b to the first area 21 a. The edgesurfaces of the first area 21 a are fitted to the edge surfaces of thesecond area 21 b. Steps of the shoulder portions of the second area 21 bhave protrusions 41 a. When the protrusions 41 a are fitted to holes 41b formed on the steps of the first area 21 a, the first area 21 a andthe second area 21 b are integrally secured.

Sixth Embodiment

FIG. 21 is a perspective view showing an example of the structure of adetachable card type storage apparatus according to a sixth embodimentof the present invention.

Edge surfaces in parallel with the inserting direction of a second area21 b of a support card to a first area 21 a thereof are formed in acurved shape. The edge surfaces of the first area 21 a are matched withthe edge surfaces of the second area 21 b. When a side surface 21 t ofthe first area 21 a is fitted with a side surface 21 s of the secondarea 21 b and the first area 21 a is inserted in the arrow direction,the first area 21 a can be integrally secured with the second area 21 b.

Seventh Embodiment

FIGS. 22A, 22B, 22C, and 22D are schematic diagrams showing anotherexample of the structure of a card type storage apparatus according to aseventh embodiment of the present invention.

FIG. 22A is a plan view showing the structure of the card type storageapparatus according to the seventh embodiment. FIG. 22B is a sectionalview taken along line A A shown in FIG. 22A. FIG. 22C is a perspectiveview showing the state that a first area 21 a is attached to a secondarea 21 b. FIG. 22D is a sectional view taken along line B-B shown inFIG. 22A.

As with the above-described embodiments, the card type storage apparatusaccording to the seventh embodiment is structured in such a manner thatthe first area 21 a is detachable from the second area 21 b. In thisexample, an edge surface 21 t of the first area 21 a is tapered. On theother hand, an edge surface 21 s of the second area 21 b is reverselytapered so that the edge surface 21 s of the second area 21 b fits theedge surface 21 t of the first area 21 a. Only an area 43 of the edgesurface of the first area 21 a is reversely tapered against the otherpart of the first area. An area corresponding to the area 43 of thesecond area 21 b of the support card has a nail-shaped hinge 44. Thehinge 44 is tapered so that it fits the area 43. In other words, thetapering direction of the side surface 21 s of the second area 21 b isreverse of that of the other portion.

With such a structure, the first area 21 a of the card type storageapparatus can be secured with the second area 21 b thereof.

With such a structure, in the card type storage apparatus according tothe present invention, since the first area 21 a is detachable from thesecond area 21 b, the first area 21 a can be attached to a host sideelectronic apparatus smaller than the outer size of the support card.

Eighth Embodiment

FIGS. 23A, 23B, and 23C are schematic diagrams showing the structure ofa support card of a card type storage apparatus according to an eighthembodiment of the present invention. FIGS. 24A, 24B, and 24C areschematic diagrams showing the structure of a storage apparatus attachedto the support card shown in FIGS. 23A, 23B, and 23C.

FIG. 23A is a plan view showing the structure of the support card. FIG.23B is a sectional view taken along line A-A shown in FIG. 23A. FIG. 23Cis a sectional view showing the structure of a support card according toanother embodiment corresponding to FIG. 23B. FIG. 24A is a plan viewshowing the structure of the storage apparatus. FIG. 24B is a sectionalview taken along line B-B shown in FIG. 24A. FIG. 24C is a sectionalview taken along line C-C shown in FIG. 24C.

The support card 50 of the card type storage apparatus has a cut-outportion 51 for detaching a storage apparatus. A bottom portion to whichthe storage apparatus is attached is composed of a SUS plate 52 that isintegrally formed with mold resin. Edge portions of the SUS plate 52 areinwardly bent for 60° so as to form a slide groove. In addition, a resinmold portion connected to the SUS plate 52 is also inwardly bent for60°.

The length L on the longer side of the support card 50 is around 45.0mm. The length S on the shorter side of the support card is around 37.0mm. The width of the inner bottom surface of the SUS plate 52 in theslide groove shape is 19.5 mm. A notch 54 is formed at the rear edge ofthe storage apparatus 53 of the card type storage apparatus. Both sideedges of the storage apparatus 53 are tapered at an angle of around 60°so that the storage apparatus 53 is inserted into a concave portion ofthe slide groove of the support card 50. The length L on the longer sideof the storage apparatus 53 is around 33.5 mm. The length S on theshorter side of the storage apparatus 53 is around 19.0 mm.

Since the storage apparatus 53 is detached from the support card 50 andthe only the storage apparatus 53 is attached to a host side electronicapparatus, the electronic apparatus 53 can be compactly structured.

FIGS. 25A and 25B show another example of the structure of the storageapparatus 55 used for the card type storage apparatus according to thepresent invention.

FIG. 25A is a perspective view showing the storage apparatus. FIG. 25Bis a sectional view taken along line, A-A of FIG. 25A. The storageapparatus 55 is fitted to a frame member 56 composed of synthetic resin.The storage apparatus 55 and the frame member 56 are integrally adheredwith adhesive resin so as to result in a card shape as a whole.

The frame member 56 has a shoulder portion b and a hole portion c. Thesubstrate 55 a is fitted to the shoulder portion b. A molding resinportion 55 b is fitted to the hole portion c. When the storage apparatus55 is fitted to the shoulder portion b and the hole portion c, thestorage apparatus 55 is formed in a card shape.

Uneven portions 57 are formed on both the front and rear surface of theframe member 56. With the uneven portions 57, the user can easilyattach/detach the storage apparatus 56 to/from the frame member 56. Inaddition, a hole 58 that fits a protrusion of the support card is formedon the frame member 56 so as to secure the storage apparatus 55 to thesupport card. A peripheral portion of the hole 56 of the frame member 56is structured so that the hole is fitted to or separate from theprotrusion of the support card with a click function.

Further, FIG. 25C shows the state that the storage apparatus 55 of FIG.25A is inserted into the support card 50.

Ninth Embodiment

FIG. 26 is a block diagram showing the structure of which a card typestorage apparatus according to the present invention is applied to apicture/audio storage medium of a digital audio system.

The card type storage apparatus (smart medium) according to the presentinvention is connected to a smart medium controller through a connector.The smart medium controller inputs and outputs picture/audio informationthrough an interface under the control of a CPU.

A digital signal that is read from the smart medium is supplied to adecoder through the CPU. The decoder decodes the digital informationinto a picture signal or an audio signal. The picture signal isreproduced by an LCD. The audio information is reproduced by an audiounit (not shown) through an audio interface. An input signal is suppliedto an encoder. The encoder encodes the input signal into a digitalsignal. The digital signal is recorded to the smart medium through theinterface. When a signal is input/output, when necessary, the signal isencrypted or decrypted.

These operations are performed with for example key switches.

According to the present invention, since the molding resin isunsymmetrically disposed on the wiring substrate, the storage apparatuscan be properly attached to the host side unit. Thus, theuser-friendliness improves. In addition, the semiconductor apparatus canbe prevented from malfunctioning and being damaged.

In the storage apparatus according to the present invention, since theserial access type memory device and the flat type external connectionterminal are used in combination, the outer size of the storageapparatus becomes close to the outer size of the memory device. Thus,the storage apparatus according to the present invention is suitable foran external storage apparatus used in a small mobile communicationterminal such as a portable telephone unit, a PHS unit, a pocket bell,or a PDA.

In addition, when the serial access type memory device and the flat typeexternal connection terminal are used in combination, the structure ofthe fiat type external connection electrodes of the storage apparatusand the structure of the host side electronic apparatus can bestandardized.

In the card type storage apparatus according to the present invention,since the molding resin of the storage apparatus is unsymmetricallyfitted to the support card, the storage apparatus can be properlyattached to the support card. Thus, the user-friendliness improves.Consequently, the storage apparatus can be prevented from malfunctioningand being damaged.

In the card type storage apparatus according to the present invention,since the support card is separated into a plurality of portions, thestorage apparatus can be connected to a host side unit that is smallerthan the outer size of the support card.

In the electronic apparatus according to the present invention, thestorage apparatus can be properly attached to the electronic apparatus.Thus, when the storage apparatus is connected to a host side electronicapparatus such as a portable telephone unit, a PHS unit, a pocket bell,a PDA, a. PC, or a digital camera, the electronic apparatus can beprevented from malfunctioning or being damaged. In addition, theuser-friendliness remarkably improves. So far, it was difficult toaccomplish an external connecting unit that can be used in common with aportable telephone unit, a PHS unit, a pocket bell, a PDA unit, adigital camera, a note type PC, a PC, and so forth. However, with thestorage apparatus and the electronic apparatus according to the presentinvention, data such as telephone numbers registered to a portabletelephone unit and text data, picture data, and so forth receivedthrough Internet can be transferred to and shared with other informationprocessing units.

Although the present invention has been shown and described with respectto a best mode embodiment thereof, it should be understood by thoseskilled in the art that the foregoing and various other changes,omissions, and additions in the form and detail thereof may be madetherein without departing from the spirit and scope of the presentinvention.

1-33. (canceled)
 34. An electronic apparatus, comprising: a wiringsubstrate having a first surface and a second surface, a flat typeexternal connection terminal disposed on the first surface of saidwiring substrate, a semiconductor device disposed on the second surfaceof said wiring substrate and having a connection terminal connected tosaid flat type external connection terminal, molding resin for coatingsaid semiconductor device on the second surface of said wiringsubstrate, a card type supporting frame having a concave portion or ahole portion formed on at least one surface of said card type supportingframe, the concave portion or the hole portion fitting said wiringsubstrate, said semiconductor device, and said molding resin in such amanner that said flat type external connection terminal is exposed tothe first surface of said wiring substrate, and adhesive resin filled ina supporting space formed among said flat type external connectionterminal, said wiring substrate, said semiconductor device, said moldingresin, and said card type supporting frame so as to integrally adheresaid flat type external connection terminal, said wiring substrate, saidsemiconductor device, said molding resin, and said card type supportingframe; supporting means for supporting said storage apparatus; aconnection electrode that is contacted to said flat type connectionterminal when said storage apparatus is supported by said supportingmeans; and a driving circuit for accessing said semiconductor devicethrough said connection electrode and said flat type external connectionterminal.
 35. The electronic apparatus as set forth in claim 34, whereinsaid driving circuit serially accesses said semiconductor device.
 36. Astorage apparatus, comprising: a wiring substrate having a first surfaceand a second surface, the second surface having a first area and asecond area, the first area being unsymmetrically located with respectto a perimeter of said wiring substrate; a flat type external connectionterminal disposed on the first surface of said wiring substrate; asemiconductor device disposed on the first area of the second surface ofsaid wiring substrate and having a connection terminal connected to saidflat type external connection terminal; molding resin which coats saidsemiconductor device and the first area of the second surface of saidwiring substrate so as to render the second area of the second surfaceuncovered; and a supporting frame having a concave portion or a holeportion, the concave portion or the hole portion fitting said wiringsubstrate and said molding resin in such a manner that said flat typeexternal connection terminal is exposed.
 37. A storage apparatus,comprising: a wiring substrate having a first surface and a secondsurface, the second surface having a first area and a second area, thefirst area deviating along a longer side of said wiring substrate; aflat type external connection terminal disposed on the first surface ofsaid wiring substrate; a semiconductor device disposed on the first areaof the second surface of said wiring substrate and having a connectionterminal connected to said flat type external connection terminal;molding resin which coats said semiconductor device and the first areaof the second surface of said wiring substrate so as to render thesecond area of the second surface uncovered; and a supporting framehaving a concave portion or a hole portion, the concave portion or thehole portion fitting said wiring substrate and said molding resin insuch a manner that said flat type external connection terminal isexposed.
 38. The storage apparatus as set forth in claim 36, furthercomprising: adhesive resin filled between said supporting frame and atleast one of said wiring substrate and said molding resin.
 39. Thestorage apparatus as set forth in claim 37, further comprising: adhesiveresin filled between said supporting frame and at least one of saidwiring substrate and said molding resin.
 40. The storage apparatus asset forth in claim 36, wherein said supporting frame is a card type, andthe concave portion or the hole portion is formed on at least onesurface of said supporting frame.
 41. The storage apparatus as set forthin claim 37, wherein said supporting frame is a card type, and theconcave portion or the hole portion is formed on at least one surface ofsaid supporting frame.
 42. The storage apparatus as set forth in claim38, wherein said adhesive resin is so filled as to integrally adheresaid flat external connection terminal, said wiring substrate, saidsemiconductor device, said molding resin, and said supporting frame. 43.The storage apparatus as set forth in claim 39, wherein said adhesiveresin is so filled as to integrally adhere said flat external connectionterminal, said wiring substrate, said semiconductor device, said moldingresin, and said supporting frame.
 44. The storage apparatus as set forthin claim 36, wherein the area of said supporting frame is the half orless of the area of said flat type external connection terminal.
 45. Thestorage apparatus as set forth in claim 36, wherein said semiconductordevice is a serial access type semiconductor.
 46. The storage apparatusas set forth in claim 36, wherein said semiconductor device is a flashmemory.
 47. The storage apparatus as set forth in claim 36, wherein saidsemiconductor device is a NAND type EEPROM or an AND type EEPROM. 48.The storage apparatus as set forth in claim 36, wherein said flat typeexternal connection terminal is composed of a conductor layer disposedon the first surface of said wiring substrate and having a slit forseparating the first surface into a plurality of areas.
 49. The storageapparatus as set forth in claim 48, wherein a pattern of the slitconnects any two points of the outer periphery of the conductor layer asa curved line or a bent line.
 50. The storage apparatus as set forth inclaim 37, wherein the area of said supporting frame is the half or lessof the area of said flat type external connection terminal.
 51. Thestorage apparatus as set forth in claim 37, wherein said semiconductordevice is a serial access type semiconductor.
 52. The storage apparatusas set forth in claim 37, wherein said semiconductor device is a flashmemory.
 53. The storage apparatus as set forth in claim 37, wherein saidsemiconductor device is a NAND type EEPROM or an AND type EEPROM. 54.The storage apparatus as set forth in claim 37, wherein said flat typeexternal connection terminal is composed of a conductor layer disposedon the first surface of said wiring substrate and having a slit forseparating the first surface into a plurality of areas.
 55. The storageapparatus as set forth in claim 54, wherein a pattern of the slitconnects any two points of the outer periphery of the conductor layer asa curved line or a bent line.